Silicon Sputtering Targets, High Purity, Monolithic, Planar, Disc, N-type Doping, Bonding, PVD Coating, Thin Film Deposition, Magnetron Si Sputtering Targets Manufacturer and Supplier

Haohai offers Silicon Sputter Target, Boron doped Silicon Sputter Target for thin film and coating applications such as Optical, large area glass coating (Low-E) for architecture, automotive glass, touch panel glass (AR).

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Product Details

Silicon Sputtering Targets, High Purity, Monolithic, Planar, Disc, N-type Doping, Bonding, PVD Coating, Thin Film Deposition, Magnetron Si Sputtering Targets Manufacturer and Supplier


SILICON SPUTTERING TARGET

 

Haohai offers Silicon Sputter Target, Boron doped Silicon Sputter Target for thin film and coating applications such as Optical, large area glass coating (Low-E) for architecture, automotive glass, touch panel glass (AR).

 

Haohai Silicon Sputtering Targets include Silicon Rotatable sputtering targets and Silicon planar sputtering targets.

 


 

Silicon Rotatable (Rotary, Cylindrical) Sputtering Target


Manufacturing Range

OD (mm)ID (mm)Length (mm)Custom Made
80 - 16060 - 125100 - 4000

 

Specification

CompositionSi
Purity3N (99.9%)
Density2.33 g/cm3
Grain Sizes< 150  micron or on request
Fabrication ProcessesCasting, HPS, Plasma Spraying, Machining
ShapeStraight, Dog bone
End Types

SCI,   SRF, DSF, RFF, WFF, VA, GPI Ends Fixation, Spiral Groove, 

Custom Made   for SS Backing Tube

SurfaceRa 1.6 micron

 

Other Specification

 Vapor degreased and demagnetized after final machining.

 ID to be HONED and OD GROUND after raw tube is produced to ensure ID to OD concentricity meets drawing requirements.

 High vacuum tight, leak rate at any location not to exceed 1 x 10-8 STD CC/SEC.

 Sealed in plastic, wrapped in foam to protect, and ends capped to protect seal surfaces.

 


  

Silicon Planar (Rectangle, Circular) Sputtering Target

 

Manufacturing Range

RectangleLength (mm)Width (mm)Thickness (mm)Custom Made
10 - 200010 - 3003.175 - 20
CircularDiameter (mm)
Thickness (mm)
5.0 - 300
3.175 - 20


Specification

CompositionSi (Boron doped)
Purity3N (99.9%), 4N (99.99%), 5N (99.999%)
Density2.33 g/cm3
Grain Sizes< 100 micron or on request
Fabrication ProcessesCasting, Machining, Bonding
ShapeMulti-segmented Target, Bonding on Cu Backing plate
TypesPlate, Disc, Step, Down bolting, Threading, Custom Made
SurfaceRa 1.6 micron

 

Other Specifications

Flatness, clean smooth surface, polished, free of crack, oil, dot, etc.

Excellent conductions, small linear expansion coefficient and good heat-resistance.

 


 

For Haohai Silicon sputtering targets

 

Tolerance

Acc. to drawings or on request.

 

Production of sputtering targets from undoped or Boron doped Silicon includes CZ growth of ingots with annealing, material analysis, cutting and machining.

 

Backing plates and Bonding service

Haohai provide many standard OFHC Copper backing plates for commercially available sputtering and cathodic arc deposition systems, as well as custom designs. Both Metallic and Epoxy Bonding of Silicon tiles is available.

  

Impurities Content [ppm]

Silicon Content [ppm]     
Si
Purity [%]
99.9
Metallic Impurities [ppm]Al500
Ca25
Cr30
Cu50
Fe150
Mn20
Ni30
Non-Metallic Impurities [ppm]N300
O6000
Resistivity [ohm.cm] 20℃< 20
Guaranteed Density [g/cm3]2.2
Grain Size [μm]150


Application

 Large Area Glass Coating

 Display Industry

 Optical Coating

 Solar & Photovoltaic Industry




Haohai Metal (Haohai Titanium), equipped with professional factory, is one of the leading manufacturers and suppliers for various materials and sizes of sputtering targets. Our silicon sputtering target, with high purity, include spayed or bonding rotatable (rotary, cylindrical) targets, planar (rectangle, disc) targets, which are extensiely used in pvd coating for thin film deposition technology. Welcome to buy and wholesale our low price, high usage rates, high purity and high quality silicon targets.

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