Semiconductor with ultra-high purity metal sputtering target and high-purity metal sputtering target difference?
Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc . can also be applied to the field of glass coating; can also be applied to wear-resistant materials, high temperature corrosion , High-end decorative supplies and other industries.
Classification According to the shape can be divided into long target, square target, round target, shaped target can be divided according to the composition of the metal target, alloy target, ceramic target according to the application is divided into different semiconductor-related ceramic target, recording medium ceramic target Materials,metal sputtering target ceramic targets, superconducting ceramic targets and giant magnetoresistance ceramic targets are classified into microelectronic targets, magnetic recording targets, optical disk targets, precious metal targets, thin film resistance targets, conductive films Target, Surface Modification Target, Mask Target, Decorative Layer Target, Electrode Target, Package Target, Other Target
How to overcome the magnetron sputtering target target utilization is low, the film deposition is not uniform
Rotating targets are widely used in solar cells, architectural glass, automotive glass, semiconductors, flat-panel TVs and other industries.
Cylindrical rotating targets have high magnetic field strength, high target sputtering efficiency, and high film deposition rate, allowing deposition of a uniform film on a large area planar substrate on both sides of the target. At the same time through the rotation mechanism to improve the utilization of the target. The target cooling is more adequate, the target surface can withstand more powerful sputtering. metal sputtering target Combining this with mid-frequency dual-target magnetron sputtering can significantly increase production efficiency while reducing production costs.
Magnetron sputtering has many advantages, metal sputtering target but also low deposition rate and uneven etching of the target surface, the utilization rate of the target is low and so on. Such as the target plane utilization of the target is generally only about 20% to 30%, resulting in its sputtering efficiency is relatively low. For some such as gold, silver, platinum and some high-purity alloy target, such as the preparation of ITO film, electromagnetic film, superconducting film, dielectric film and other film needs of precious metal target, how to overcome the magnetron sputtering Target target utilization is low, the film is not uniform and other shortcomings of deposition is very important.
Rectangular plane magnetron sputtering target target etching unevenness is mainly reflected in two aspects, on the one hand is uneven etching in the target width direction, on the other hand, the traditional design of the rectangular sputtering target sputtering target plane Road is closed track shape, in the target end of the diagonal position prone to abnormal etching phenomenon, but also in the end of the target and straight straight connection of the Department of serious corrosion, and the middle region of the shallow etching, metal sputtering target and etching Serious parts are always diagonally distributed, so the phenomenon is also called end effect or diagonal effect. The end etching effect of the target greatly reduces the consistency of the depth of the etching channel, and the cylindrical rotating target can solve these problems well and therefore has higher utilization rate.