Titanium sputtering target
Titanium sputtering target requirements are higher than those of traditional materials industry. General requirements such as size, flatness, purity, impurity content, density, N / O / C / S, grain size and defect control; higher requirements or special Requirements include: surface roughness, resistance, grain size uniformity, composition and organization uniformity, foreign matter (oxide) content and size, permeability, ultra-high density and ultra-fine grain and so on. Magnetron sputtering is a new type of physical vapor coating that uses electron guns to electronically emit and focus on the material being plated so that the sputtered atoms follow the momentum conversion principle with higher kinetic energy from the material Fly to the substrate deposited film. This kind of plated material is called titanium sputtering target. Titanium sputtering target metal, alloy, ceramic, boride and so on.
Titanium sputtering target Basic Information
Magnetron sputtering coating is a new type of physical vapor deposition method, 2013 evaporation of the coating method, many of its advantages are quite obvious. As a more mature technology has been developed, magnetron sputtering has been applied in many areas.
Titanium sputtering target Technology
Sputtering is one of the main techniques for the preparation of thin film materials. It uses ion generated by ion source to accelerate the aggregation in vacuum to form high-speed ion beam, bombard the solid surface, exchange kinetic energy of ions and solid surface atoms, So that the solid surface of the atoms away from the solid and deposited on the surface of the substrate, the bombardment of the solid is sputtering method of deposition of thin film of raw materials, known as titanium sputtering target. Various types of sputtering thin film materials have been widely used in semiconductor integrated circuits, recording media, flat displays, and surface coating of workpieces.